GETWICK has years of experience in producing premium, high performance molybdenum materials that provide suitable solutions to challenging applications in the electronics industry. The company advanced materials and technologies create value-added solutions for thermal management applications.
Molybdenum-copper is a composite material. It has similar thermal properties to the tungsten-copper composite, but its lower density makes it more suitable for applications where weight limitations are a factor.Using a molybdenum skeleton and infiltrating it with copper, a variety of Mo:Cu ratios can be created to match the performance requirements of the application.
The standard ratio is: 70% Molybdenum: 30% Copper
Copper-Molybdenum-Copper Laminates (CuMoCu)
Cu/Mo/Cu laminates also have moderate thermal conductivity and low thermal and electrical resistance. They are suitable for Si-based devices as well as for large area power devices with significant heat generation.Thermal conductivity and the coefficient of thermal expansion-mismatch of a given die are some of the key parameters involved in selecting a heat spreader material. These two parameters can be calculated by introducing a Thermal Compatibility Factor for a given heat spreader material in a simple equation: ? (Heat Spreader) / A CTE (Die - Heat Spreader). The ensuing ratio may be utilized to assess the compatibility of a heat spreader material with a given die. A high compatibility factor results from a low coefficient of thermal expansion-mismatch and a high thermal conductivity value.