TUNGSTEN AND MOLYBDENUM DISC
TUNGSTEN AND MOLYBDENUM DISC
Tungsten disc, tungsten wafer are widely used as contact materials in silicon controlled rectifiers diodes, transistors and thyristors (GTO’S), it is only involved in specialist applications. Otherwise, molybdenum is the first choice mounting material for power semiconductor devices due to its significantly lower cost and weight.
Tungsten and molybdenum have a similar coefficient of expansion to silicon combined with high thermal conductivity makes them an ideal choice, especially in large area power devices where considerable heat is generated. Further applications include the use of molybdenum and tungsten as heat sink bases in IC’S, LSI’S and hybrid circuits.
Tungsten/molybdenum discs are cut from sheets and plates by saw or EDM cutting
Applications
· Silicon Controlled Rectifiers Diodes
· Transistors
· Thyristors (GTO ‘s)
· Heat Sink Bases in IC’s, LSI’s and Hybrid Circuits Benefits
· CTE matched to semiconductor substrate
· Good thermal conductivity
· High volume production
· Proven in high value applications Discs/Tungsten
· Thickness: 0.1 mm – 6.0+ mm
